View IP3338CX24_4603006.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

IP3338CX24
10-channel integrated LC-filter network with ESD input protection to IEC 61000-4-2 level 4
Rev. 01 -- 13 November 2008 Product data sheet
1. Product profile
1.1 General description
The IP3338CX24 is a 10-channel1 LC low-pass filter network designed to filter undesired RF signals in the 800 MHz to 3000 MHz frequency band. In addition, the IP3338CX24 incorporates diodes which protect downstream components from ElectroStatic Discharge (ESD) voltages as high as 15 kV. The IP3338CX24 is fabricated using monolithic silicon technology and integrates 10 inductors and 20 back-to-back diodes in a single Wafer-Level Chip-Scale Package (WLCSP) measuring 2.11 mm by 2.11 mm (typical). These features make the IP3338CX24 ideal for use in applications requiring the utmost in miniaturization such as mobile phone handsets, cordless telephones and personal digital devices.
1.2 Features
I I I I Pb-free, RoHS compliant and halogen free package; Dark Green compliant Integrated 10-channel -type LC filter network with 60 nH channel inductance 125 series resistance; 25 pF (typical) capacitance per line Integrated ESD protection withstanding 15 kV contact discharge, far exceeding IEC 61000-4-2, level 4 I WLCSP with 0.4 mm pitch
1.3 Applications
I I I I Cellular and Personal Communication System (PCS) mobile handsets Cordless telephones Wireless data (WAN/LAN) systems PDAs
1.
Also available as a 7-channel device (IP3337CX18).
NXP Semiconductors
IP3338CX24
10-channel integrated LC-filter network with ESD input protection
2. Pinning information
2.1 Pinning
bump A1 index 1
IP3338CX24/LF
2 3 4 5
A
B
C
D
E
001aai820
Transparent top view
Fig 1. Table 1. Pin
Pin configuration IP3338CX24 Pinning Description filter channel 1 filter channel 2 filter channel 3 filter channel 4 filter channel 5 filter channel 6 filter channel 7 filter channel 8 filter channel 9 filter channel 10 ground no ball
A2 and A5 A1 and A4 B2 and B5 B1 and B4 C2 and C5 C1 and C4 D2 and D5 D1 and D4 E2 and E5 E1 and E4 A3, C3, D3, E3 B3
3. Ordering information
Table 2. Ordering information Package Name Description wafer level chip-size package; 24 bumps; 2.11 x 2.11 x 0.61 mm Version WLCSP24 Type number
IP3338CX24/LF
IP3338CX24/LF
IP3338CX24_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 13 November 2008
2 of 13
NXP Semiconductors
IP3338CX24
10-channel integrated LC-filter network with ESD input protection
4. Functional diagram
Ls(ch) Rs(ch)
A1, A2, B1, B2, C1, C2, D1, D2, E1, E2
A4, A5, B4, B5, C4, C5, D4, D5, E4, E5
A3, B3, C3, D3
001aai754
Fig 2.
Schematic diagram IP3338CX24
5. Limiting values
Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VI VESD Parameter input voltage electrostatic discharge voltage all pins to ground contact discharge air discharge IEC 61000-4-2, level 4; all pins to ground contact discharge air discharge Ich Ich(M) Pch Ptot Tstg Treflow(peak) Tamb
[1]
[1] [1]
Conditions
Min -4.0 -15 -15
Max +4.0 +15 +15
Unit V kV kV
-8 -15 -55 -35
+8 +15 10 50 10 100 260 +85
kV kV mA mA mW mW C C
channel current (DC) peak channel current channel power dissipation total power dissipation storage temperature peak reflow temperature ambient temperature
Tamb = 70 C Tamb = 70 C; 60 s continuous power; Tamb = 70 C Tamb = 70 C 10 s maximum
+150 C
Device tested with 1000 pulses of 15 kV contact discharges, according to the IEC 61000-4-2 model, which far exceeds IEC 61000-4-2, level 4 (8 kV contact discharge).
IP3338CX24_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 13 November 2008
3 of 13
NXP Semiconductors
IP3338CX24
10-channel integrated LC-filter network with ESD input protection
6. Characteristics
Table 4. Channel characteristics Tamb = 25 C; unless otherwise specified. Symbol Rs(ch) Cch Ls(ch) VBR ILR
[1]
Parameter channel series resistance channel capacitance channel series inductance breakdown voltage reverse leakage current
Conditions f = 0 Hz (DC) Vbias(DC) = 0 V; f = 1 MHz
[1]
Min 100 6 -10 -
Typ 125 25 60 -
Max Unit 150 30[1] 10 -6 100 pF nH V V nA
Itest = 1 mA Itest = -1 mA per channel; VI = 3.0 V
Guaranteed by design.
Table 5. Frequency characteristics Tamb = 25 C; unless otherwise specified. Symbol il Parameter insertion loss Conditions Rgen = 50 ; RL = 50 800 MHz < f < 1 GHz 1 GHz < f < 3 GHz at 0 Hz; Rgen = 50 ; RL = 50 ; Vbias(DC) = 0 V f-3dB cut-off frequency measured relative to insertion loss at DC; Rgen = 50 ; RL = 50 800 MHz < f < 3 GHz; Rgen = 50 ; RL = 50 38 35 6 150 40 40 7 180 10 dB dB dB MHz Min Typ Max Unit
ct
crosstalk attenuation
35
40
-
dB
7. Application information
7.1 Insertion loss
The setup for measuring insertion loss in a 50 system is shown in Figure 3.
IN
50
DUT
OUT
50
TEST BOARD
Vgen
001aai755
Fig 3.
Frequency response measurement configuration
The measured frequency response curves for all channels are shown in Figure 4.
IP3338CX24_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 13 November 2008
4 of 13
NXP Semiconductors
IP3338CX24
10-channel integrated LC-filter network with ESD input protection
0 il (dB) -10 -20 -30
(3)
001aai760
-40 -50 -60 -70 10-1
(2) (1)
1
10
102
103 f (MHz)
104
(1) Channel 1 (pins A2 and A5). (2) Channel 9 (pins E2 and E5). (3) Channel 4 (pins B1 and B4).
Fig 4.
Measured frequency response curves
7.2 Crosstalk
The setup for measuring crosstalk in a 50 system is shown in Figure 5.
IN_1
50
DUT
OUT_2 OUT_1
50 50
IN_2
50
TEST BOARD
Vgen
001aai756
Fig 5.
Crosstalk measurement configuration
The crosstalk between adjacent channels within the IP3338CX24 for different channel pairs measured in a 50 NetWork Analyzer (NWA) system, is shown in Figure 6. In all cases, all unused connections are terminated with 50 to ground.
IP3338CX24_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 13 November 2008
5 of 13
NXP Semiconductors
IP3338CX24
10-channel integrated LC-filter network with ESD input protection
ct
0
001aai758
-10 -20 -30 -40 -50 -60 -70 -80 -90 10-1 1 10 102 103 f (MHz) 104
(1) (2) (3) (4) (5) (6)
(1) Channels 2 and 6 (pins A1 and C4). (2) Channels 4 and 5 (pins B1 and C5). (3) Channels 4 and 3 (pins B1 and B5). (4) Channels 4 and 7 (pins B1 and D5). (5) Channels 2 and 1 (pins A1 and A5). (6) Channels 2 and 9 (pins A1 and E5).
Fig 6.
Measured crosstalk between adjacent channels
8. Marking
Bump A1 index
LASER MARKING AREA
001aai941
top view, balls facing down
Fig 7.
Marking of IP3338CX24/LF
IP3338CX24_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 13 November 2008
6 of 13
NXP Semiconductors
IP3338CX24
10-channel integrated LC-filter network with ESD input protection
9. Package outline
WLCSP24: wafer level chip-size package; 24 bumps; 2.11 x 2.11 x 0.61 mm IP3338CX24/LF
D
B
A
bump A1 index A2 E A
A1
detail X
e1 e b
E e D e2
C
B
A 1 2 3 4 5 X
0 Dimensions Unit mm A A1 A2 b D E e 0.4 e1 1.6 e2 1.6
1 scale
2 mm
max 0.66 0.22 0.31 2.16 2.16 nom 0.61 0.20 0.41 0.26 2.11 2.11 min 0.56 0.18 0.21 2.06 2.06
IP3338CX24_lf_po
Outline version IP3338CX24/LF
References IEC JEDEC JEITA
European projection
Issue date 08-05-29 08-09-09
Fig 8.
IP3338CX24_1
Package outline IP3338CX24/LF (WLCSP24)
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 13 November 2008
7 of 13
NXP Semiconductors
IP3338CX24
10-channel integrated LC-filter network with ESD input protection
10. Packing information
R1 R2 K1
0
D1
0.1
E
D T
C
A0 P
A
R3 W1 W
B
B
5 max
T1 G B1 F E B0
A
0.2/40 D0 P0 P2 E D C
A-A
K0 0.1 E D C A0
K
B-B
001aai751
Fig 9.
Tape and reel information Table 6. Item Overall dimensions Tape dimensions Parameter tape width thickness distance outside width Sprocket holes[1] diameter distance pitch Distance between center lines length direction width direction Symbol W K G B1 D0 E P0 P2 F Specification (mm) Dimension 8.00 1.20 0.75 3.70 1.50 1.75 4.00 2.00 3.50 Tolerance 0.3 maximum minimum maximum +0.1/-0.0 0.1 0.1 0.05 0.05
IP3338CX24_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 13 November 2008
8 of 13
NXP Semiconductors
IP3338CX24
10-channel integrated LC-filter network with ESD input protection
Tape dimensions ...continued Parameter length width depth hole diameter pitch radius radius radius depth Symbol A0 B0 K0 D1 P R1 R2 R3 K1 T W1 T1 R Specification (mm) Dimension Tolerance 0.05 0.05 0.05 0.1 0.1 maximum maximum typical -0.1 0.07 max max min 1.90 2.35 0.80 0.50 4.00 0.40 0.30 0.30 0...0.25 10 0.25 5.75 0.1 30
Table 6. Item
Compartments
Device Carrier tape anti-static[2] Cover tape[3] Bending pad
[1] [2] [3]
rotation film thickness width film thickness in winding direction
Cumulative pitch error: 0.2 mm per 10 pitches. Carbon-loaded polystyrene 100 % recyclable. The cover tape must not overlap the sprocket holes.
IP3338CX24_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 13 November 2008
9 of 13
NXP Semiconductors
IP3338CX24
10-channel integrated LC-filter network with ESD input protection
11. Design and assembly recommendations
11.1 PCB design guidelines
For optimum performance it is recommended to use a Non-Solder Mask PCB Design (NSMD), also known as a copper-defined design, incorporating laser-drilled micro-vias connecting the ground pads to a buried ground-plane layer. This results in the lowest possible ground inductance and provides the best high frequency and ESD performance. For this case, refer to Table 7 for the recommended PCB design parameters.
Table 7. Parameter PCB pad diameter Micro-via diameter Solder mask aperture diameter Copper thickness Copper finish PCB material Recommended PCB design parameters Value or Specification 200 m 100 m (0.004 inch) 337 m 20 m to 40 m OSP FR4
11.2 PCB assembly guidelines for Pb-free soldering
Table 8. Parameter Solder screen aperture diameter Solder screen thickness Solder paste: Pb-free Solder/flux ratio Solder reflow profile Assembly recommendations Value or Specification 330 m 100 m (0.004 inch) SnAg (3 % to 4 %) Cu (0.5 % to 0.9 %) 50/50 see Figure 10
T (C) Treflow(peak) 250 230 217 cooling rate
pre-heat
t1 t2
t3 t4 t5
t (s)
001aai161
The device is capable of withstanding at least three reflows of this profile.
Fig 10. Pb-free solder reflow profile
IP3338CX24_1 (c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 13 November 2008
10 of 13
NXP Semiconductors
IP3338CX24
10-channel integrated LC-filter network with ESD input protection
Characteristics Parameter time 1 time 2 time 3 time 4 time 5 rate of change of temperature cooling rate pre-heat Conditions soak time time during T 250 C time during T 230 C time during T > 217 C Min 230 60 10 30 2.5 Typ Max 255 180 30 50 150 540 -6 4.0 Unit C s s s s s C/s C/s
Table 9. Symbol t1 t2 t3 t4 t5 dT/dt
Treflow(peak) peak reflow temperature
12. Abbreviations
Table 10. Acronym DUT EMI ESD FR4 LAN NSMD OSP PCB PCS PDA PSU RoHS WAN WLCSP Abbreviations Description Device Under Test ElectroMagnetic Interference ElectroStatic Discharge Flame Retard 4 Local Area Network Non-Solder Mask Design Organic Solderability Preservative Printed-Circuit Board Personal Communication System Personal Digital Assistant Power Supply Unit Restriction of Hazardous Substances Wide Area Network Wafer-Level Chip-Scale Package
13. Revision history
Table 11. Revision history Release date 20081113 Data sheet status Product data sheet Change notice Supersedes Document ID IP3338CX24_1
IP3338CX24_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 13 November 2008
11 of 13
NXP Semiconductors
IP3338CX24
10-channel integrated LC-filter network with ESD input protection
14. Legal information
14.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
14.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
15. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
IP3338CX24_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 13 November 2008
12 of 13
NXP Semiconductors
IP3338CX24
10-channel integrated LC-filter network with ESD input protection
16. Contents
1 1.1 1.2 1.3 2 2.1 3 4 5 6 7 7.1 7.2 8 9 10 11 11.1 11.2 12 13 14 14.1 14.2 14.3 14.4 15 16 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 4 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Crosstalk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 Packing information. . . . . . . . . . . . . . . . . . . . . . 8 Design and assembly recommendations . . . 10 PCB design guidelines . . . . . . . . . . . . . . . . . . 10 PCB assembly guidelines for Pb-free soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 13 November 2008 Document identifier: IP3338CX24_1

▲Up To Search▲

Price & Availability of IP3338CX24

	To Download IP3338CX24 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .